Meet the recipients of the 2026 IEEE Medals—the organization’s highest-level honors. Presented on behalf of the IEEE Board of Directors, these medals recognize innovators whose work has shaped modern technology across disciplines including AI, education, and semiconductors.
The medals will be presented at the IEEE Honors Ceremony in April in New York City. View the full list of 2026 recipients on the IEEE Awards website, and follow IEEE Awards on LinkedIn for news and updates.
Sponsor: IEEE
Santa Clara, Calif.
“For leadership in the development of graphics processing units and their application to scientific computing and artificial intelligence.”
Sponsor: IBM
Pittsburgh
“For contributions to the advancement of societal improvement and education through innovative technology.”
Sponsor: Nokia Bell Labs
University of California, Berkeley
“For contributions to Internet architecture, network resource allocation, and software-defined networking.”
Sponsor: Mani L. Bhaumik
Co-recipients:
Erik Dahlman
Stefan Parkvall
Johan Sköld
Stockholm
“For contributions to and leadership in the research, development, and standardization of cellular wireless communications.”
Sponsor: Google
Medford, Mass.
“For contributions to computer vision and simulation algorithms, and for leadership in developing programs to promote STEM careers.”
Sponsor: The Edison Medal Fund
“For pioneering contributions to biomedical imaging, terrestrial optical communications and networking, and inter-satellite optical links.”
Sponsor: Toyota Motor Corp.
University of Texas at Arlington
“For contributions to advancing electrical safety in the workplace, integrating renewable energy and grid modernization for climate change mitigation.”
Sponsor: IEEE Foundation
Reston, Va.
“For leadership in communication networks, including acceleration of digital equity, responsible Artificial Intelligence, and the promotion of diversity and inclusion.”
Sponsor: Qualcomm, Inc.
“For contributions to coding for reliable communications and networking.”
Sponsor: Friends of Nick Holonyak, Jr.
University of California, Santa Barbara
“For seminal contributions to compound semiconductor optoelectronics, including high-efficiency visible light-emitting diodes, lasers, and LED displays.”
Sponsor: IEEE Engineering Medicine and Biology Society
“For pioneering contributions to wearable affective computing for health and wellbeing.”
Sponsor: Apple
“For contributions to signal modeling, coding, and recognition for speech communication.”
Sponsor: ARM, Ltd.
“For the development of the recollision model for strong field light–matter interactions leading to the field of attosecond science.”
Sponsor: IEEE Life Members Fund and MathWorks
James H. McClellan
“For fundamental contributions to electrical and computer engineering education through innovative digital signal processing curriculum development.”
Sponsor: IEEE Jun-ichi Nishizawa Medal Fund
Hanover, N.H.
“For the invention, development, and commercialization of the CMOS image sensor.”
Sponsor: Intel Corp.
Santa Clara, Calif.
“For pioneering parallel computing architectures and leadership in semiconductor design that transformed artificial intelligence, scientific research, and accelerated computing.”
Sponsor: RTX
“For contributions to polarimetric synthetic aperture radar imaging and its utilization.”
Sponsors: IEEE Industry Applications, Industrial Electronics, Power Electronics, and Power & Energy societies
“For contributions to Z-Source and modular multi-level converters for distribution and transmission networks.”
Sponsor: Northrop Grumman Corp.
LogiQ, Inc.
Arlington, Va.
“For leadership in national security, civil, and commercial systems engineering and development of elegant design principles.”
Sponsor: IBM
San Jose, Calif.
“For contributions to database query languages, particularly Structured Query Language, which powers most of the world’s data management and analysis systems.”
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